Samsung combines its new mobile memory chip of 3GB of RAM, 32GB flash in a single package

Samsung has started producing vastly what’s being called the industry’s first ePoP, By combining two key smartphone elements into a single package, Samsung’s solution promises to offer handset makers about 40 percent extra space.

They have been offering a similar single-package solution for some wearable devices for some time now. Wearable Memory, includes DRAM, a controller and NAND flash on a single chip that can also be stacked on top of an application processor.

Korean tech giant’s ePoP for smartphones combines a 32GB eMMC (embedded multi-media card) and a controller into a single package, a 3GB LPDDR3 DRAM module. The 3GB LPDDR3 mobile DRAM operates at an I/O data transfer rate of 1,866MB/sec and supports a 64-bit I/O bandwidth.

And most importantly this package can be stacked directly on top of the mobile processor without taking up any additional space and the package is heat resistant.

It’s a good improvement over existing two-package eMCP memory solutions that could afford manufacturers the freedom to install larger battery packs or further help to reduce device thickness.

Samsung also said that it will expand its ePoP lineup over incoming years, to include packages with enhanced performance and density.

More to follow.

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